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Rebuilt from the project repository README: DELETED unsourced infobox (4-layer PCB, 2023, model SE30RL), the F1/F3/D3 fuse-and-diode troubleshooting rows, the UE8 claim and the no-electrolytics/32-bit-clean-ROM feature claims; added the six reverse-engineered PALs with their board locations and Apple part numbers, the CC-BY-NC-SA licence, the ATF16V8B/C device caution, and consistency checks against Apples own SE/30 documentation; stray </div> tags and malformed table attributes fixed; refs a...
 
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{{Infobox hardware
[[File:SE30_Reloaded_Board.jpg|thumb|250px|Assembled SE/30 Reloaded logic board]]
| name          = Macintosh SE/30 Reloaded Logic Board
The '''Macintosh SE/30 Reloaded logic board''' is a modern recreation of the [[Macintosh SE/30]] main logic board, published by Bolle. It is '''not a 1:1 copy''': the original schematics were used to redesign and re-route a lookalike board.<ref name="repo">TheRealBolle, ''Macintosh SE/30 logicboard recreation'', project repository README — design basis, reverse-engineered PALs and their board locations, licence and board-file notes. https://github.com/TheRealBolle/SE30</ref>
| image          = [[File:SE30_Reloaded_Board.jpg|250px]]
| caption        = Fully assembled SE/30 Reloaded Logic Board
| type          = Logic Board
| designer      = Community-designed (Based on original Apple SE/30)
| manufacturer  = Independent / DIY
| release_date  = 2023
| discontinued  = N/A
| layers        = 4-layer PCB
| compatibility  = Macintosh SE/30
| features      = Modern design, SMD components, Apple ASICs, GAL-based PAL replacements, 32-bit clean ROM support
| model          = SE30RL
}}
The '''Macintosh SE/30 Reloaded Logic Board''' is a modern re-imagining of the original [[Macintosh SE/30]] motherboard. Unlike a one-to-one clone, this project redesigns the logic board using a 4-layer PCB, modern surface-mount components, and enhanced reliability. It is functionally compatible with the original Mac SE/30 and accepts most of its original chips and connectors.
[[File:SE30 Reloaded.jpg|center|thumb|Fully assembled SE/30 Reloaded Logic Board]]


== Preparation and Inspection ==
The project files are released under '''CC-BY-NC-SA''' and are explicitly not intended for commercial use.<ref name="repo" />
{| class="wikitable"
 
! Step !! Description
This page covers the recreation board. For the original machine see [[Macintosh SE/30]]; for repairing an original board, [[Macintosh SE/30 General Maintenance]] and the [[Macintosh SE/30 Capacitor Replacement Guide]].
 
== Why the board exists ==
 
An original SE/30 logic board fails in one characteristic way: its surface-mount electrolytic capacitors leak, the electrolyte corrodes traces and vias, and by the time the symptoms are obvious the damage is under the components. Boards that have lost traces in the video or sound sections are repairable but tedious, and some are beyond it. A new board lets the Apple-specific silicon from a damaged board be reused.
 
== What the project reproduces, and what it does not ==
 
'''Reproduced.''' The board itself, and the programmable logic. The original PALs were reverse-engineered and their equations rewritten to match the behaviour of the originals; the JEDEC files supplied are '''not''' dumps of the original devices. They target 16V8-type parts — GAL16V8, PALCE16V8 or ATF16V8.<ref name="repo" />
 
<templatestyles src="Template:StyledTable/styles.css" />
{| class="wikitable styled-table" style="width:60%;"
|+ '''Reverse-engineered PALs and their original Apple part numbers'''<ref name="repo" />
! Board location !! Original Apple part
|-
| UI6 || 341-0665-A
|-
|-
| '''Cleaning''' || Use >90% isopropyl alcohol and a lint-free wipe to clean both sides of the board.
| UH7 || 341S0689-C
|-
|-
| '''Inspection''' || Under magnification, inspect the PCB for any shorts, broken pads, or fabrication issues.
| UG6 || 341-0747-A
|-
|-
| '''Dry Fit Checks''' || Fit sockets and large connectors to verify alignment.
| UG7 || 341-0746-A
|-
|-
| '''ESD Precautions''' || Always wear a grounded wrist strap and work in an ESD-safe area.
| UE6 || 341-0754-A
|-
| UE7 || 341-0755-A
|}
|}


== Required Components and Tools ==
'''Device caution from the project:''' certain low-power '''ATF16V8B''' parts do not work, and '''ATF16V8C''' parts use pin keepers rather than internal pull-ups and may also be problematic.<ref name="repo" />
'''Required Components and Tools'''
 
{| class="wikitable"
'''Not reproduced.''' Apple's custom devices — the CPU support ASICs, the sound and floppy controllers, the ROM — are not part of the project. They have to come from a donor logic board or from the parts market, which is why a corroded original is worth keeping rather than scrapping.
! Components !! Tools
 
== Files and manufacture ==
 
The gerbers are generated with the JLCPCB EAGLE CAM job files and the pick-and-place data is intended for JLCPCB; other manufacturers may require different output. A bill of materials is published with the project.<ref name="repo" />
 
== Consistency with the original ==
 
Two things are worth checking against the original machine's documentation rather than assumed:
 
* The SE/30's screen does '''not''' come out of main memory. The logic board carries a separate 64 KB video display RAM and an 8192-byte video declaration ROM mapped at $FE00 0000, which Apple calls pseudo-slot video. Any recreation has to provide both.<ref name="gtmfh">Apple Computer, ''Guide to the Macintosh Family Hardware'', 2nd edition, Addison-Wesley, 1990, Chapter 12 "Displays", pp. 408–409.</ref>
* The memory rules are the original machine's rules: eight 30-pin SIMM sockets in two banks of four, 120 ns or faster, eight chips per module, banks filled completely, larger modules in bank A.<ref name="gtmfh2">Apple Computer, ''Guide to the Macintosh Family Hardware'', 2nd edition, Addison-Wesley, 1990, Chapter 5 "Memory", pp. 208–211.</ref> See [[Macintosh SE/30 Memory Upgrade Guide]].
 
For tracing signals during a build, the MIT-licensed KiCad recreation of Apple engineering drawing '''050-0253-01''' hosted here is the most usable reference, and its pin matrices give the device at each location — UK8 CPU, UI5 FPU, UI8 GLUE, UK12/UK11 VIA1/VIA2, UJ11 SWIM, UI12 SCSI, UG12 SCC, UK6 video ROM, UC6/UC7 VRAM, J13 PDS.<ref name="redraw">''Macintosh SE/30 Logic Board Schematic Redraw'', KiCad recreation of Apple engineering drawing 050-0253-01, MIT licence. Hosted on this wiki: [[:File:Macintosh SE30 Logic Board Schematic Redraw 050-0253-01.pdf]].</ref>
 
== Assembly ==
 
=== Before you start ===
{| class="wikitable styled-table" style="width:75%;"
! Step !! Detail
|-
| '''Clean''' || Isopropyl alcohol (>90 %) and a lint-free wipe, both sides.
|-
| '''Inspect''' || Under magnification, look for shorts, lifted pads and fabrication defects before any part is fitted.
|-
| '''Dry fit''' || Offer up sockets and the large connectors to check alignment.
|-
|-
|
| '''ESD''' || Grounded wriststrap and an ESD-safe surface throughout.
* Apple custom ASICs: GLU, ASC, SWIM, ADB, RTC
* 6× GAL16V8 chips (programmed)
* EPROM (27C64 Video ROM)
* SMD & through-hole capacitors, resistors, diodes
* Connectors, SIMM sockets, ROM SIMM
|
* Temperature-controlled soldering iron
* Hot air rework station
* Fine-gauge solder (0.5mm)
* No-clean flux pen and syringe flux
* ESD tweezers and microscope
* Multimeter, oscilloscope, logic analyzer (optional)
* GAL and EPROM programmers
|}
|}
</div>
== Assembly Techniques ==


=== Surface-Mount Soldering ===
=== Soldering ===
[[File:SMD Drag Soldering.mp4|center|thumb|SMD drag soldering demonstration]]
{| class="wikitable styled-table" style="width:75%;"
{| class="wikitable"
! Component !! Technique
! Component !! Technique
|-
|-
| 0402/0603 passives || Pre-tin one pad, place the component, solder the second pad.
| 0402/0603 passives || Tin one pad, place the part, solder the second pad, then reflow the first.
|-
| SOIC and QFP || Drag soldering or pin-by-pin, with plenty of flux.
|-
|-
| SOIC, QFP ICs || Use drag soldering or pin-by-pin with ample flux.
| PLCC || Tack opposite corners first, check seating, then solder the remaining leads.
|-
|-
| PLCC ICs || Align carefully; tack corners; drag or point solder the leads.
| Through-hole || Tack one pin, confirm the part is square and flush, then solder the rest and trim.
|}
|}


=== Through-Hole Soldering ===
Use sockets for the CPU, FPU and ROM unless you are certain you will never need to swap them.
[[File:Through_Hole_Connectors.jpg|thumb|center|Proper through-hole connector installation (placeholder)]]


* Use sockets for CPU, FPU, ROM unless soldering directly.
[[File:Through_Hole_Connectors.jpg|thumb|center|Through-hole connector installation]]
* Align and tack first, then solder each pin.
* Use flush cutters to trim excess leads.
* Confirm each pin has solid contact and solder fill.


== Recommended Assembly Sequence ==
=== Suggested order ===
# Power-related components (fuses, oscillator)
# Power-related parts and the oscillator
# All SMD passives
# Surface-mount passives
# SMD ICs and transistors
# Surface-mount ICs and transistors
# PLCC/DIP sockets and SIMM connectors
# PLCC and DIP sockets, SIMM sockets
# External ports, headers, switches, and jacks
# Connectors, headers, switches and jacks


== Initial Testing and Diagnostics ==
== First power-up ==
=== Power Check ===
* Use a bench power supply with current limiting.
* Check resistance between +5V and GND before powering.
* After applying power: verify +5V, +12V, and -12V rails.
* Feel for overheating components.


=== Subsystem Tests ===
* Bring it up on a current-limited bench supply, not in the machine.
'''Subsystem Verification'''
* Check the resistance between +5 V and ground before applying power; a dead short means a bridge or a reversed part.
{| class="wikitable"
* Verify each rail, then check for parts running hot.
* Only once the board is stable on the bench should it go into a chassis — where the CRT makes probing hazardous. Read [[CRT Discharge Procedure]] first.
 
{| class="wikitable styled-table" style="width:70%;"
! Subsystem !! Test
! Subsystem !! Test
|-
|-
| ROM/CPU || Boot chime, screen output
| ROM and CPU || Boot chime and something on screen
|-
|-
| RAM || System boots, memory reported in OS
| RAM || Boots, and the reported total matches what is fitted
|-
|-
| Video || CRT displays proper raster and icons
| Video || Stable raster, correct geometry
|-
|-
| Sound || Audible startup chime and software playback
| Sound || Startup chime, then software playback
|-
|-
| ADB || Mouse and keyboard functionality
| ADB || Keyboard and mouse respond
|-
|-
| SCSI/Floppy || Boot from known-good media, verify termination and data lines
| SCSI and floppy || Boot from known-good media; check termination
|}
|}
</div>


== Troubleshooting ==
== Troubleshooting a build ==
[[File:Simasimac issue.jpg|center|thumb|Simasimac error screen]]
 
{| class="wikitable"
[[File:Simasimac issue.jpg|center|thumb|Simasimac]]
! Symptom !! Potential Cause
 
|-
{| class="wikitable styled-table" style="width:75%;"
| No boot, black screen || Check clock oscillator, reset pin, CPU alignment
! Symptom !! Where to look
|-
|-
| Simasimac || ROM access failure, bad socket, missing GALs
| No boot, black screen || Oscillator, reset line, CPU orientation and socket seating
|-
|-
| Death chimes || RAM error, GAL timing, bad addressing
| Simasimac (striped raster) || ROM access — socket seating, ROM SIMM contacts, and the RAM-signalling PALs
|-
|-
| Blank video || Video ROM missing, UE8 or PAL issue
| Death chimes || RAM: seating, bank population, SIMM speed, and the RAM-signalling PALs
|-
|-
| No ADB || Fuse F1, ADB chip (UL11), PRAM battery
| No video, machine otherwise alive || Video ROM and the video PALs at UE6/UE7/UG6/UG7
|-
|-
| No floppy || Check SWIM chip, F3 fuse, D3 diode
| No ADB, no floppy, no SCSI || Solder joints on the relevant connector and its support parts; then the donor ASIC
|-
| No SCSI || Termination issue, 53C80 controller
|}
|}


== Key Improvements Over Original ==
Faults specific to a hand-built board are overwhelmingly solder faults and wrong or missing programmable parts, not design faults. Compare a suspect signal against the schematic redraw before replacing anything.
* 4-layer PCB reduces noise and improves signal reliability.
* No electrolytic capacitors – replaced with SMD ceramics/tantalum.
* Standardized SIMM and ROM socket layout.
* Optional 32-bit clean ROM SIMM support (no need for MODE32).


== Community Resources ==
== Community resources ==
* [https://68kmla.org 68kMLA Forum]
 
* [https://tinkerdifferent.com TinkerDifferent Community]
* [https://github.com/TheRealBolle/SE30 Project repository — schematics, gerbers, JEDEC files and BOM]
* [https://github.com project GitHub Repository (schematics, JEDEC files)]
* [https://68kmla.org 68kMLA forum] — build threads and troubleshooting
* [https://tinkerdifferent.com TinkerDifferent]


== Gallery ==
== Gallery ==
<gallery>
<gallery>
File:SE30 Reloaded.jpg|Assembled board
File:SMD Soldering Technique.jpg|SMD soldering
File:SMD Soldering Technique.jpg|SMD soldering
File:Simasimac issue.jpg|Simasimac
File:Simasimac issue.jpg|Simasimac
File:Through Hole Connectors.jpg|Through Hole Soldering
File:Through Hole Connectors.jpg|Through-hole soldering
</gallery>
</gallery>
== Related pages ==
* [[Macintosh SE/30]]
* [[Macintosh SE/30 General Maintenance]]
* [[Macintosh SE/30 Capacitor Replacement Guide]]
* [[Macintosh SE/30 Memory Upgrade Guide]]
* [[Recommended Tools]]
== References ==
<references />


[[Category:Apple Vintage Computers]]
[[Category:Apple Vintage Computers]]
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